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Diamond Wafering Blades, Metal Bonded Diamond Wafering Blades, Resin Bonded Wafering Blades

sectioning mounting grinding polishing
  Diamond Wafering Blades, Diamond Wafering Blades, wafering blades, wafering, blades,
Diamond Wafering Blades, Diamond Wafering Blade,Diamond, Wafering,Blades

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Diamond Wafering Blades

Metal Corporation Diamond Wafering blades come in sizes of:

Diamond Wafering Blades (3" diameter)
Diamond Wafering Blades (4" diameter)
Diamond Wafering Blades (5" diameter)
Diamond Wafering Blades (6" diameter)
Diamond Wafering Blades (7" diameter)
Diamond Wafering Blades (8" diameter)
Diamond Wafering Blades (10" diameter)
Diamond Wafering Blades (12" diameter)
Diamond Wafering Blades (14" diameter)
 
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METAL BONDED DIAMOND WAFERING BLADES ARE

HIGH CONCENTRATION METAL BOND continuous rim diamond wafering blades are recommended for aggressive general laboratory sectioning of ductile materials, most metals, polymers, pc boards, thermal spray coatings and titanium. (Used on higher loads & speeds)

 Diamond Wafering Blades, Diamond Wafering Blades

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HIGH CONCENTRATION DIAMOND WAFERING BLADES, WAFERING BLADES

Catalog # Description  Concentration  Qty
M306H 3 X .006 X HIGH EACH
M412H 4 X .012 X HIGH EACH
M515H 5 X .015 X HIGH EACH
M620H 6 X .020 X HIGH EACH
M725H 7 X .025 X HIGH EACH
   

METAL BONDED DIAMOND WAFERING BLADES ARE

LOW CONCENTRATION METAL BOND continuous rim diamond wafering blades are recommended for sectioning very hard or brittle materials including ceramics, carbides, re-fractories, silicon, boron composites and glass. (allows for higher loads being applied at sample interface). (Used on lower loads & speeds)

 Diamond Wafering Blades, Diamond Wafering Blades

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LOW CONCENTRATION DIAMOND WAFERING BLADES, WAFERING BLADES

Catalog # Description  Concentration  Qty
M306L 3 X .006 X LOW  EACH
M412L 4 X .012 X LOW EACH
M515L 5 X .015 X LOW EACH
M620L 6 X .020 X LOW EACH
M725L 7 X .025 X LOW EACH
   

RESIN BONDED DIAMOND WAFERING BLADES ARE

RESIN BOND DIAMOND WHEELS. continuous rim diamond blades are recommended for cutting of ferrous metals.

 Diamond Wafering Blades, Diamond Wafering Blades

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RESIN BONDED DIAMOND WAFERING BLADES, WAFERING BLADES

Catalog # Description  Concentration  Qty
M845D 8 X .045 X 1-1/4 (32mm) RESIN  EACH
M1050D 10 X .050 X 1-1/4 (32mm) RESIN  EACH
M1262D 12 X .062 X 1-1/4 (32mm) RESIN  EACH
M1470D 14 X .070 X 1-1/4 (32mm) RESIN  EACH
   
 
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